| 摘要 |
<p>PURPOSE:To perform selective remote signal transmission by light and improve the performance by arranging a plurality of light conducting paths on the main plane of an integrated circuit on a large silicon chip by crossing the paths more than once and arranging a circular grating and a buried optical element at the cross point. CONSTITUTION:A plurality of light emitting/receiving parts 3 are provided in a silicon wafer 1 and the parts 3 are connected by light conducting paths 2. The distance Lo between the light conducting path 2 and the light emitting/ receiving part 3 is set longer than a case that the sum of the electric transmission electric circuit delay time and the sum of the electric transmission wiring resistance delay time are larger than the sum of the conversion time from light to an electric signal and the conversion time from an electric signal to light in the wafer. A central light emitting/receiving part 4 is provided at the center of a wafer scale integrated circuit so as to feed and receive data by a buried optical element device 5 and optical beams are passed through. The light conducting paths 2 are extended radially from the center and the facing light emitting/receiving parts 3 are set on a straight line.</p> |
