发明名称 RESIN SEALING MOLD FOR RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To eliminate the air remaining in a cavity in the case of completing pouring of resin. CONSTITUTION:A mold 7 has a structure which has a resin reservoir 6 formed continuously to a cavity 4 and a gate between the cavity 4 and the reservoir 6 is openable by a vertically moving gate switching pin 5. At the time of pouring resin, the resin is poured until the air at the end of the resin in the cavity 4 is all discharged into the reservoir 6, the pin 5 is then moved to shut OFF the gate to the reservoir 6. Further, it is pressurized until an injection pressure completely reaches a resin pressure, thereby reducing a void malfunction.
申请公布号 JPH05218122(A) 申请公布日期 1993.08.27
申请号 JP19920040319 申请日期 1992.01.30
申请人 NEC CORP 发明人 IWASE YOSHIHIRO
分类号 H01L21/56;B29C45/02;B29L31/34 主分类号 H01L21/56
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