| 摘要 |
PURPOSE:To prevent resin from leaking during resin injection and 3-dimensional wiring pattern from being damaged by forming a resin leakage preventing wall in an armor part of an insulating substrate and by pressing a pressing part of a molding die to the resin leakage preventing wall by the use of a spring. CONSTITUTION:An insulating substrate 1 is formed with a plurality of devices in series integrally and a 3-dimensional wiring pattern P is formed thereon. In the process, a resin leakage preventing wall is formed in an armor part of the insulating substrate 1 as thick as the 3-dimensional wiring pattern P. Then, resin is injected once from a runner part through a gate for a plurality of devices by using dies 10, 11 and then sealed to form a package 8 having a lens 6. In the process, pressing parts 10a, 11a of the dies 10, 11 are pressed floatably to the 3-dimensional wiring pattern P and the resin leakage preventing wall by a spring 14. Thereafter, dicing is performed by a dicing line to remove the runner part and the gate. Thereby, it is possible to prevent resin from leaking during resin injection. |
