| 摘要 |
PURPOSE:To prevent solder paste from spreading over an unnecessary region of a substrate by providing a plurality of projection parts in a surface to be mounted on a substrate, by introducing a conductor pattern connected to an electrode to a surface of the projection part and by soldering a conductor pattern covering a surface of the projection part to a conductor for packaging. CONSTITUTION:Hemispheric projection parts 6 are provided to four corners of a rear of a package 1. A conductor pattern 2 connected to each electrode of an optical semiconductor chip 3 provided with two electrodes is arranged to attain a surface of the projection part 6 from above a bottom of an inside of a recess. When the conductor pattern 2 is soldered to a printed substrate 7, solder paste is surely attached thereto without spreading over an unnecessary region. In the case of two electrodes of the mounting optical semiconductor chip 3, the projection part 6 which does not require for providing the conductor pattern 2 for leading out an electrode is formed on a surface. In this case, the conductor pattern 2 covering the projection parts 6 is provided and all the projection parts 6 are soldered. Thereby, stable soldering is realized. |
