发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 <p>PURPOSE:To increase the joining strength of casing containers to each other by making the protruding sections of the casing containers thicker in wall thickness than the main bodies of the casing containers and partially providing a section filled up with a foamable resin and a through hole in the joint section of the protruding sections. CONSTITUTION:The joint surfaces of protruding sections are faced to each other and, at the same time, grooves 7e having semicircular cross sections are respectively formed on the joint surfaces at the locations which become apexes when a foamable resin is foamed and hardened so that the grooves 7e can cross the joint surfaces. The grooves 7e form a hole which transversely passes through the joint surfaces like a tunnel when the joint surfaces are put together. In addition, small projections 8 for welding are formed in a belt on the joint surface of one of casing containers 7 over the entire periphery so that the casing containers 7 can be efficiently stuck to each other by ultrasonic welding. Since the wall thicknesses of protruding section 7c and 7d which become joint sections are made thicker than those of the main bodies of the containers, the joining strength of the containers to each other can be increased.</p>
申请公布号 JPH05218236(A) 申请公布日期 1993.08.27
申请号 JP19920020006 申请日期 1992.02.05
申请人 RYODEN KASEI CO LTD;MITSUBISHI ELECTRIC CORP 发明人 KOTAI SHOJIRO;OCHI KATSUNORI
分类号 B42D15/10;G06K19/077;G11C5/00;H01L23/28 主分类号 B42D15/10
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