| 摘要 |
<p>PURPOSE:To materialize the enlargement of a part mounting area and miniaturization by forming a groove at the side face of a ceramic multilayer circuit board, ranging from the rear of the circuit board to the middle layer of the circuit board, and electrically connecting the circuit pattern at the surface of the circuit board with the middle layer of the circuit board through a through hole. CONSTITUTION:This ceramic multilayer circuit board 11 is made by stacking printed wiring layers 12-15 consisting of ceramic, where wiring patterns are printed using silver paste, respectively Plural pieces each of through holes (0.2-0.3mm in diameter) are made in each printed wiring layer 12-15 by printing silver paste on the land part of the wiring pattern, and a plurality of grooves 17 semicircular in top view are made at the side faces of the printed wiring boards 14 and 15, and these through holes 16 and groove 17 are covered with a conductive material. Moreover, a plurality of groove-shaped terminals 18 for electrically connecting with other circuit board are made at the margin of the rear of the printed wiring board 15.</p> |
