| 摘要 |
<p>PURPOSE: To provide a method for controlling a wire-bonding process which can directly monitor bonding work at the time of bonding, and a machine for executing the method. CONSTITUTION: In a wire-bonding process for bonding a wire 8 to the contact surface of an electric element or an electronic element 10, ultrasonic energy is applied to a bonding tool 2 fixed to an ultrasonic transducer 6. The bonding tool 2 presses a wire 8 against the contact surface of the electric element or the electronic element 10 and monitors the deformation of the wire 8. The supply level and the duration time of ultrasonic energy (and, arbitrarily, the magnitude of the bonding strength) are continuously controlled during the bonding process in a closed loop system, according to the deformation of the wire.</p> |
