| 摘要 |
<p>PURPOSE: To provide a semiconductor device and its manufacturing method which enable direct bonding of a chip and leads by forming a bonding pad of a chip in the end portion of the chip on a scribe line. CONSTITUTION: Aluminum, having a specified thickness is vapor-deposited on the chip part position of a bonding surface of a lead 41 of a connection terminal to be bonded to a bonding pad 35 of a chip 31, and the bonding pad 35 of the chip 31 is positioned on the chip end portion on the scribe line. Thereby bondability of an interface between the chip 31 and the lead 41 can be improved, and a bump and a gold ball are made unnecessary, so that direct bonding of the chip 31 and the lead 41 can be made. The bump thickness can be reduced as compared to a conventional TAB system. As a result of the simplification of an assembling process, productivity improvement and cost reduction are realized, and application for all the packages as well as a fine gap package needing high reliability can be made.</p> |
