| 摘要 |
PURPOSE:To easily bond even if a chip size is small in the method of bonding an optical semiconductor element having the step of bonding the element to a submount. CONSTITUTION:The method for bonding an optical semiconductor element comprises the steps of providing a holder 11 adjacent to an optical semiconductor element chip 10, so adjacently disposing a spacer member 13 on a placing member 12 as to become in plane with a placing surface 12a of a submount 12, bonding the chip 10 provided integrally with the holder 11 to the submount 12 provided integrally with the member 13 to form an optical semiconductor element block 18, and dividing the block 18 into boundaries 14, 16 to isolate the chip 10 and the holder 11.
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