| 摘要 |
PURPOSE:To obtain an LSI cooling heat sink having a high heat transferring ability by using a plated net as a fin group and joining one end of the net with a heat diffusing plate. CONSTITUTION:Spiral meshed net wires 4 are soldered 5 to a heat diffusing plate 10 put on the upper surface of a package 2. The wires 4 are meshed in such a way that their adjacent longitudinal or transversal wires are not arranged in completely parallel with each other so that small recessing and projecting sections can be repeatedly formed in a phase-shifted state. Therefore, the wires on the downstream side hardly directly receive the influence of a dead water region formed by the wires on the upstream side. The title LSI cooling heat sink is formed in such a way that the heat sink has a square shape and its heat sink section is formed by more closely winding the central section of the spiral than the outer peripheral section. As a result, the heat transfer coefficient of the heat sink can be improved, because cooling air can follow according to the spiral shape of the mesh. Therefore, when the meshed net wires are used, a spiral LSI cooling heat sink having an excellent cooling effect and strong rigidity can be formed. |
