| 摘要 |
PURPOSE:To lower manufacture cost by reducing photolithography processes when manufacturing a multilayer wiring substrate where film wiring layers and insulating layers are stacked alternately, and these film wiring layers are connected electrically by a via. CONSTITUTION:The film wiring layer 2 at the first layer is made on an alumina board 1, and then a via is made, which has a height capable of protruding the film wiring layer 7 at the second layer on the film wiring layer 2 at the first layer. Then, the insulating layer 6 at the first layer and the film wiring layer 7 at the second layer are made in order, and the film wiring layer 2 at the first layer and the film wiring layer at the second layer are connected by the via 11, and also the film wiring layer 7 at the second layer is protruded on the via 11, and next, the insulating layer 9 at the second layer and the film wiring layer 10 at the third layer are formed in order, and the film wiring layer 7 at the second layer and the film wiring layer 10 at the third layer are connected directly. |
