| 摘要 |
PURPOSE:To improve the positional accuracy in the boring of a through hole in the case of having used an adhesive requiring a large quantity of etching for the roughening of an adhesive layer, in the manufacture of a multilayer printed wiring board for which active method and a pin lamination method are used and also where the reference hole at lamination is used in common for the reference hole at boring of a through hole. CONSTITUTION:A copper foil 1 is made around the reference hole 5 at the outermost layer by making a multilayer substrate 4 by pin lamination method, in the condition that a copper foil 1 as a metallic foil is arranged at the outermost layer, and removing the copper foil 1, leaving the periphery of the reference hole 5. Next, a through hole is opened after performing the formation of an adhesive layer 7 onto the surface of the multilayer substrate 4 and roughening of the adhesive layer 7. |
