发明名称 RADIATION SENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain high sensitivity and high O2-RIE resistance by incorporating linear poly (siloxane) having a C-O-Si bond in each monomer unit and an acid generating agent to be allowed to generate an acid by decomposition due to action of radiation. CONSTITUTION:This resin composition contains a linear poly-(siloxane) having a C-O-Si bond in each monomer unit and an acid generating agent producing an acid by irradiation with a radiation, such as light, electron beams. X-rays, or ion beams. It is considered that the acid generator produces an acid at the spot irradiated with the radiation and the acid cuts the C-O-Si bond at this spot to produce a silanol group. This poly (siloxane) is a poly (dialkoxysiloxane) or poly (diaryloxy-siloxane) represented by formula I in which each of R<1> and R<2> is, independently, a primary, secondary, or tertiary alkyl or aryl group; R<3> is H or a trimethylsilyl group; and n is a polymerization degree.
申请公布号 JPH05216237(A) 申请公布日期 1993.08.27
申请号 JP19920017588 申请日期 1992.02.03
申请人 OKI ELECTRIC IND CO LTD 发明人 ITO TOSHIO;SAKATA YOSHIKAZU
分类号 G03F7/004;G03F7/028;G03F7/038;G03F7/039;G03F7/075;H01L21/027;H01L21/30 主分类号 G03F7/004
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