| 摘要 |
PURPOSE:To make it possible to change the exposure conditions for each discrimination mark of each wafer at the time of exposure by providing the device with the function to read wafer discrimination marks. CONSTITUTION:A wafer discrimination mark on a wafer 9 is taken as an image into an alignment optical system 11 and then the discrimination mark can be recognized by an image processing section 12 and the discrimination mark processing section 14. Therefore, (1) job errors due to the verification of wafer marks can be reduced, (2) an experiment of classifying wafers can be done, (3) exposure can be done with an exposure area of only a part of the wafers expanded, and (4) the plural kinds of wafers is treated as the same lot and can be processed in a batch. |
