发明名称 PATTERN FORMING METHOD
摘要 PURPOSE:To enable the application of the method to lithography using radiations of short wavelengths, such as UV rays and ionizing radiations and to form fine patterns having rectangular sections without generation of the eaves occurring in hardly soluble layers. CONSTITUTION:This method has a stage for forming a radiation sensitive layer consisting essentially of a radiation sensitive compsn. having a compd. which can generate an acid by irradiation with chemical radiations and at least one bonds which can be decomposed by the acid on a substrate, a stage for forming an acidic coating layer on the radiation sensitive layer, a stage for irradiating the radiation sensitive layer and the acidic coating layer with the chemical radiations in patterns and a stage for subjecting the radiation sensitive layer and the acidic coating layer to development processing.
申请公布号 JPH05216244(A) 申请公布日期 1993.08.27
申请号 JP19920244714 申请日期 1992.09.14
申请人 TOSHIBA CORP 发明人 NIKI HIROICHI;ONISHI KIYONOBU;HAYASE RUMIKO;OYASATO NAOHIKO;KOBAYASHI YOSHIHITO;SATO KAZUO;MIYAMURA MASATAKA;KUMAGAI AKITOSHI
分类号 G03F7/26;G03F7/004;G03F7/039;G03F7/09;G03F7/11;G03F7/38;H01L21/027 主分类号 G03F7/26
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