| 摘要 |
<p>PURPOSE:To achieve high-density wiring and low line-to-line capacitance by using a circuit board which has one surface having bonding pads and the other surface carrying a multilayer interconnection layer containing a multiplicity of wiring layers with insulating interleaves of an organic resin. CONSTITUTION:Bonding pads 13 are formed on the top surface of a substrate 12 and, to the bonding pads 13, LSIs 14 are bonded through the intermediary of wirings 15 for connection with the outside. On the rear surface of the substrate 12, through the intermediary of an organic insulating layer 16, a multilayer interconnection layer 18, built of a multiplicity of wiring layers 17 by means of the thin film technique, is arranged. To bumps 19, which are input/output terminals of the interconnection layer 18, female connectors 20 are connected, which is accomplished when input/output terminals 21 on the rear surface of the connector section are fixed by solder 22. In this way, wirings may be very fine in a very high density package and capacity between signal lines may be reduced.</p> |
