发明名称 PACKAGE FOR ELECTRONIC COMPONENT AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To provide metallized lines, which connect the outer ends of ground lines on the upper surface of a lower-step ceramic frame body to the outer ends of a ground layer on the lower surface of the ceramic frame body, on the outside surface on the ceramic frame body easily and swiftly by transfer. CONSTITUTION:Notches 700 are provided in the outside surface, which is positioned between adjacent metallized paste lines 400 for ground line use on the upper surface of a lower-step ceramic green sheet frame body 200, of the frame body 200. Then, wide metallized paste lines 420 for metallized line use are provided on the outside surface of the frame body 200 excepting places, where the notches 700 are provided, by transfer. After that, the lines 420 are fired integrally with the frame body 200.</p>
申请公布号 JPH05218227(A) 申请公布日期 1993.08.27
申请号 JP19920056391 申请日期 1992.02.05
申请人 SHINKO ELECTRIC IND CO LTD 发明人 ICHIKAWA KEIICHI;MIYAGAWA FUMIO;MIYAMOTO TAKAHARU
分类号 H01L23/12;H01L23/15 主分类号 H01L23/12
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