| 摘要 |
PURPOSE:To shorten unbindering process by unbinding a multilayer structure, wherein objects in each of which copper paste is printed on a glass ceramic green sheet and in a through hole and a wiring pattern is made are stacked, in steam atmosphere in high concentration. CONSTITUTION:In the manufacture of a multilayer wiring board capable of increasing signal transmission speed, wherein copper being a low melting point metal, as a conductor material, and glass ceramic lower in dielectric constant are baked at the same time, first a through hole is made in the green sheet for a glass ceramic wiring board, and copper paste is printed in this green sheet and on the green sheet so as to stick a conductor wiring pattern. Next, the multilayer structure being made by stacking these glass ceramic green sheets, whereon wiring patterns are made, into a multilayer is heated in nitrogen atmosphere at high steam pressure to decompose and remove the binder contained in the green sheet and the copper paste. Then, the low resistance of the wiring is maintained by baking it in reductive atmosphere. |
