| 摘要 |
A bump having a shape adapted to bonding of a flip chip method and an enough volume is efficiently accurately formed at low costs. By applying a pressure into a chamber, a fused solder 8 in the chamber 1 is extruded from a micro opening 3 and adhered onto a pad 12. After that, by eliminating the pressure, the fused solder is separated by the surface tension of the fused solder itself and is allowed to remain as a solder bump onto the pad.
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