发明名称 Method and apparatus for selective soldering
摘要 Disclosed is a method and apparatus for applying flux and solder in order to attach connectors to printed circuit boards (PCBs). Flux is applied to the connector tails and the PCB pads by means of a roller mounted above a flux reservoir. The piece parts are then exposed to a solder wave such that the solder sticks only to the selected area to which the flux was applied.
申请公布号 US5238175(A) 申请公布日期 1993.08.24
申请号 US19920921868 申请日期 1992.07.29
申请人 AT&T BELL LABORATORIES 发明人 HUGHEY, RONALD R.;SALVA, JOSEPH M.
分类号 B23K1/08;B23K1/20;H05K3/34 主分类号 B23K1/08
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