| 摘要 |
PURPOSE:To improve the productivity, reliability, etc., of a wiring structure by applying a photosensitive polymer composition comprising a polymer of a specified composition and a photosensitizer to the surface of the wiring structure and during the wet film to form a surface protective film thereon. CONSTITUTION:A polymer consisting mainly of repeating units of the formula (wherein R<1> is a 4C or higher tetravalent organic group; and R<2> is a bivalent organic group) is reacted with 1-400 pts.wt. hydroxylated amine compound (e.g. 2-dimethylaminoethanol) and 1-400 pts.wt. isocyanate compound containing a C-C double bond (e.g. 2-isocyanatoethyl methacrylate). The resulting polymer is mixed with a photosensitizer (e.g. Michler's ketone) to produce a photosensitive polymer composition. A surface protective film made from a cured product of this composition is formed on the surface of a wiring structure. |
