发明名称 MOLDING RESIN COMPOSITION
摘要 PURPOSE:To obtain the title composition improved in compatibility and excellent in mechanical strengths, flexibility, heat resistance, etc., by adding a specified vinyl copolymer to a mixture of a specified polyamide resin with a thermoplastic polyester resin. CONSTITUTION:0.1-10 pts.wt. vinyl copolymer comprising 40-99wt.% vinyl monomer of formula I (wherein R1 is H or lower alkyl; R2 is phenyl, cyano or an alkyl ester group with 1-10C alkyl) and 60-1wt.% vinylic glycidyl ester monomer of formula II (wherein R3 is H or lower alkyl) [e.g. glycidyl methacrylate/styrene (20/80wt.%) copolymer] is added to 100 pts.wt. mixture comprising 10-90wt.% polyamide resin (e.g. nylon 12) having a molar ratio of the terminal amino groups to the terminal carboxyl groups of 1.5 or above and 90-10wt.% thermoplastic polyester resin (e.g. polybutylene terephthalate resin) to obtain the title composition.
申请公布号 JPH05214244(A) 申请公布日期 1993.08.24
申请号 JP19920016219 申请日期 1992.01.31
申请人 POLYPLASTICS CO;DAICEL CHEM IND LTD 发明人 HORIUCHI HIROO;WADA MITSUO;WAKITA NAOKI;WATANABE ICHIJI
分类号 C08L67/02;C08L67/00;C08L77/00 主分类号 C08L67/02
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