| 发明名称 |
MANUFACTURE OF SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:To complete the adhesion through single jig setting by previously applying an adhesive to an electrode or semiconductor of a composite material of copper-carbon fiber. |
| 申请公布号 |
JPS5440568(A) |
申请公布日期 |
1979.03.30 |
| 申请号 |
JP19770106703 |
申请日期 |
1977.09.07 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L21/52;H01L23/12;H01L23/48 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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