| 摘要 |
PURPOSE:To provide the soldering device which can solder an electrode having an extremely small width without relying on a large-scale method, such as CVD. CONSTITUTION:The laser beam from an Nd:YAG laser 1 is converted to a doughnut-shaped ring mode by an axicon prism 2 and is converged by a lens 3 so as to focus at the open defect point 5 on a substrate 4. The powder 7 of the solder from a solder powder tank 8 is supplied through a nozzle 9 into a laser beam tunnel. The supplied powder 7 of the solder is passed through the inside of the laser beam tunnel until the powder. arrives at the focus, where the powder is melted. The melt is packed into the open defect point 5. |
