| 摘要 |
PURPOSE:To prevent a deformation of a wire and eliminate a sagging of the wire and short circuit between the wires and reduce the size of a semiconductor device, by fastening the wire to a resin dam of a lead frame formed midway between an inner lead and a semiconductor element and by sealing all of then with a resin. CONSTITUTION:A method for manufacturing a semiconductor device, wherein a lead frame 10 provided with a resin dam 12 formed between an inner lead 11 and a die pad 13 is prepared, and a die 15 is mounted on the die pad 13, and the die 15 and the inner lead 11 are connected by a wire 16, and the wire 16 is fastened to the resin dam 12 by a bonding resin 17, and in that state, all of them are sealed with a sealing material 18 made of a resin. |
