| 摘要 |
<p>PURPOSE: To provide an apparatus and method for detecting absence of a wire to be connected in a wire bonding apparatus in use for electrical connection of a semiconductor device. CONSTITUTION: A shifted distance of a connecting tool 3 is measured during the connection of a connecting material 4, the measured distance is compared with a predetermined value, and when the measured value is smaller than the predetermined value, an error signal is produced to indicate the absence of the connecting material. The apparatus comprises a touch-down mechanism 7 for pushing the connecting tool 3 against a connection position 5, a support 11, on which the mechanism 7 is flexibly mounted, a stationary contact 19 fixed to the support 11, and a movable electrical contact fixed to the mechanism 7.</p> |
