| 摘要 |
PURPOSE:To reduces the spaces between pads and prevent sagging and curling of a wire loop, in a wire bonding method of a semiconductor device. CONSTITUTION:A wire bonding method of a semiconductor device, wherein when wire-bonding the semiconductor device a gold ball 14a is formed beforehand on a pad 12a of a semiconductor chip 12, and a gold wire 14 is jointed to an external terminal 13 of a lead frame, and the gold wire 14 is stretched, and thereafter, the gold wire 14 is wedge-bonded to the gold ball 14a formed on the pad 12a of the semiconductor chip 12. |
