| 摘要 |
<p>PURPOSE:To prevent slipping-down when a semiconductor wafer is held by using air tweezers, and to suck the semiconductor wafer smoothly. CONSTITUTION:A retaining member 5 connected to a suck button 3 is mounted in addition to the sucking section 4 of air tweezers 1, and a pawl 5b is set up to the retaining member 5. According to such structure, when a semiconductor wafer 2 is sucked by the sucking section 4 by depressing the suck button 3, the retaining member 5 of the semiconductor wafer 2 holds the semiconductor wafer at the same time. Consequently, the retaining member 5 of the semiconductor wafer 2 is installed in addition to the sucking section 4, thus positively holding the semiconductor wafer, then allowing improvement in operating efficiency.</p> |
