REED FRAME MATERIAL AND ITS PRODUCTION

摘要

PURPOSE:To provide a reed frame material capable of wire bonding in the atmosphere and inexpensively being surface-treated. CONSTITUTION:The reed frame material used for transistors or ICs or the like has a recrystallized structure 15 made by heat-treating a silver layer 11 provided on the uppermost surface of a base material 14 after coating or a rolling structure made by rolling the silver layer after coating and the reed frame material like this is obtained by heat-treating the silver applied >=0.3mum on the surface of the base material 14 in an inert gas atmosphere or reducing atmosphere at a temp of >=200 deg.C and below the softening point of the base material for >=5sec or by annealing the silver applied by >=0.3mum on the surface of the base material in an inert gas atmosphere or reducing atmosphere at 400-800 deg.C for >=5sec before final rolling process.