发明名称 STRUCTURE OF MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To provide a multilayer printed wiring board having an effective dielectric constant of approx. 1, nearly equal to that of air and having less parasitic capacitance to transmit signals with sharp leading edges by a method wherein an insulating layer is formed of a grating-like insulator between insulating films. CONSTITUTION:An insulating grating provided with separators 6 and spaces 7 between the separators 7 is sandwiched between insulating films 9 to form an insulator, and the insulator concerned is arranged between conductor layers 2. An opening is provided to a printed wiring board at points correspondent to the through-holes 1a and 1b of the film 9. The conductor layer pattern 2 is formed on the insulating film 9 through plating or bonding. The through-hole 1a formed penetrating through the board and the blind hole 1b where a through- hole plating layer 4 is formed respectively are provided to the insulator at prescribed points, whereby conductor layers 2 are electrically connected together.
申请公布号 JPH05211396(A) 申请公布日期 1993.08.20
申请号 JP19920011494 申请日期 1992.01.27
申请人 NEC CORP 发明人 GOSHIMA TAKAO
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址