| 摘要 |
PURPOSE: To prevent short-circuiting of a plurality of leads and also prevent generation of noise induced between adjacent bads or between land pattern, by arranging the leads in such a manner that the adjacent leads have different distances from a package body. CONSTITUTION: A plurality of leads 32 are arranged, so that the distances of adjacent leads from a package body 30 to their positions to be located on a wiring substrate are mutually different. That is, the number of such distances as mentioned above is set to be two, and adjacent leads 32 are arranged in a staggered manner. For this reason, a semiconductor package 31 of the present invention has a mounting width B, when compared with a conventional semiconductor package having a plurality of leads arranged in a row which has a mounting width C. |
