| 摘要 |
<p>PURPOSE:To realize a small pitch junction without short circuit between leads by increasing the pins as required as the functions of a semiconductor device are diversified with its increased capacity. CONSTITUTION:Bumps 10 are formed to a semiconductor substrate 4 through pad electrodes 11, and an insulating film 12 is formed between the bumps 10. Inner leads 6 are bonded with the bumps 10 by using a film carrier tape with the inner leads 6, front ends of which are bonded. The bonding sections 6A of the leads between the bumps 10 are cut.</p> |
