| 摘要 |
PURPOSE:To reduce a size of a multichip package for mounting a plurality of semiconductor integrated circuit packages on the same board and to improve power source noise in a high speed signal transmission. CONSTITUTION:A multichip package 16 mounts a plurality of semiconductor integrated circuit package structures 12 formed of a flexible board 3 for placing a semiconductor integrated circuit package on a multichip package board 13, and mounts a bypass capacitor 10 between a connecting terminal for a power source and a connecting terminal for a ground on a rear surface of the board 3 by directly soldering 9. |
