| 摘要 |
PURPOSE:To not only separate joining sections to a wiring board of a plurality of leads sufficiently from each other but also make the pitches of the leads small for surface-mounted electronic parts, into which an IC chip is incorporated and which surrounds the IC chip and to which the array of a plurality of the leads to be joined with the wiring board is formed. CONSTITUTION:The joining sections 21, 21 of adjacent leads 2 are displaced in the directions of the array of the leads mutually while being separated in the directions orthogonal to the directions of the array of the leads in the joining sections 21 to a wiring board of a plurality of the leads 2. |
