| 摘要 |
PURPOSE:To make it possible to measure a potential in the substrate of a semiconductor device during operation at the time of evaluation easily and correctly without tearing a package for the device encapsulated by molding. CONSTITUTION:Bonding pads 6 electrically connected to a substrate for a semiconductor chip 1 on the semiconductor chip 1 are electrically connected with an island for holding the chip in a fixed state at the time of binding or leads for island fixing use by bonding wires 8B and a potential in the whole island 2 is set at an equal potential with a potential in the substrate for the chip 1. |
