| 发明名称 |
PLATING METHOD OF PRINTED WIRING BOARD |
| 摘要 |
PURPOSE:To form a reliable electroless plating layer inside a blind hole by removing air bubbles from the blind hole large in aspect ratio. CONSTITUTION:A printed wiring board 6 mounted on a jig 2 inside a hermetically closable tank 1 is made to swing and vibrate by a support 3, and the tank 1 is evacuated to remove air bubbles from blind holes.
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| 申请公布号 |
JPH05211384(A) |
申请公布日期 |
1993.08.20 |
| 申请号 |
JP19910303691 |
申请日期 |
1991.11.20 |
| 申请人 |
NEC CORP |
发明人 |
MURAKAMI ASAO;ONUKI HIDEFUMI;TSUNODA TAKANORI;MANIWA AKIRA |
| 分类号 |
C23C18/31;C23C18/38;C25D21/04;C25D21/10;H05K3/00;H05K3/18;H05K3/24 |
主分类号 |
C23C18/31 |
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