| 摘要 |
<p>Solder wire (10) having an outer metallic wall structure (12) of a metal composition, surrounding a core mass (16) of metal particles (18); suitably the metal particles (18) are dispersed in a solder flux (20) forming a cream or paste; the metal particles (18) and the metal composition together form a solder composition, at a soldering temperature; in this way metals and alloys which are hard and/or brittle and can not be manufactured, without varying degrees of difficulty, into a wire form, can be employed in a solder wire. Additionally solder wire can be manufactured containing a toxic metal such as lead, but which can be safely handled, by employing the toxic metal as a component of the core mass (16) and not as a component of the metallic wall structure (12).</p> |
