Micropack integrated circuit mfr. using connection spider - has separate stations for separation of outer leads, separation of associated retaining strips and bending into spider format

摘要

The method involves using a production line with successive operating stations, for separation of the outer leads from below, for separation of the retaining strips (25,26) between the outer leads on all 4 sides of the IC chip (21) from above and for formation of the spider, respectively. The first station uses upwardly displaced cutting elements, the second station uses downwardly displaced cutting elements and the third station uses a flexure die stamp moved downwards cooperating with flexure segments which are moved upwards to form a U bend in each of the outer lead sets. ADVANTAGE - Ensures correct relative spacing of closely packed outer leads.