| 摘要 |
<p>PURPOSE:To accurately and easily divide a semiconductor wafer into fine semiconductor pellets by utilizing the expansion force due to frozen liquid filled in fine grooves to separate the wafer. CONSTITUTION:Fine grooves 13 of predetermined pattern are formed on one surface of a semiconductor wafer 12 formed with a plurality of elements 15, and liquid substance 14 such as water or the like is filled in the gaps of the grooves 13. Then, a cooling device for sufficiently cooling the wafer 12 to freeze the substance 14 is applied for the wafer 12 filled with the substance 14 in the grooves 13 to freeze the substance 14 in the grooves 13. In this case, the wafer 12 is ruptured along the grooves 13 to obtain the respective independent semiconductor pellets by the expansion force of the substance 14.</p> |
