| 摘要 |
<p>This invention relates to a composition suitable for the removal of an acid or rosin modified flux residue from a printed circuit board, which composition consists essentially of (a) between about 30 and about 80 weight % of a flux solubilizing agent selected from the group of an N- C1 to C6 alkyl pyrrolidone, an N- C1 to C4 alkyl caprolactam, tetramethylurea, dimethylimidiazolidinone and mixtures thereof and (b) between about 20 and about 70 weight % of a non-toxic, water-soluble, corrosion controlling agent which is not the same as (a) and which has a boiling point within about 25 °C of said flux solubilizing agent and is selected from the group of C2 to C3 alkylene glycol, tetra-lower alkyl urea, 2 to 4 poly(propylene glycol lower alkyl ether) and 2 to 4 poly(propylene glycol lower alkyl ether acetate). The invention also relates to the process for using said composition in a semi-aqueous defluxing process.</p> |
