| 摘要 |
PURPOSE:To provide the photosensitive resin composition adapted to a positive type resist enhancing heat resistance without lowering resolution. CONSTITUTION:The positive type photosensitive resin composition comprises an alkali-soluble novolak resin and tris(4-hydroxyphenyl)methane, and 1,2- naphthoquinonediazido compound, and this resin is the one obtained by condensing under an acid catalyst the mixture of m-cresol A, p-cresol B, and 3,5-xylenol C having a composition in a hatched part between the side lines and the boundary line as shown in graph 1 represented by the triangular coordinates (D unit; molar % ratio) and an aldehyde mixture of formaldehyde and chloroacetaldehyde in a molar ratio of 90:10-50:50, and removing the fraction having a weight average molecular weight of 1,000-5,000 in terms of standard polystyrene from the condensation product. |
