发明名称 SEMICONDUCTOR CHIP
摘要 PURPOSE:To efficiently perform the sampling inspection and a trimming work at the times of trially manufacturing, designing a circuit, analyzing the malfunction of the circuit and manufacturing in mass production the circuits by forming a window at the prescribed position of an insulating film formed on the upper surface of the circuit and exposing the circuit through the window. CONSTITUTION:The prescribed circuit block 7 is mounted on a semiconductor substrate 6. A silicon insulating film 8 is formed thereon. A window 9 is formed partly at the film 8. The aluminum wire 10 of the block 7 is exposed through the window 9. Thus, at the stages of trially manufacturing, sampling and inspecting and trimming the semiconductor chips, the check of the disconnection of the wire 10 can be readily performed by contacting a cutting stylus or circuit check measuring element through the window 9.
申请公布号 JPS57106143(A) 申请公布日期 1982.07.01
申请号 JP19800181982 申请日期 1980.12.24
申请人 HITACHI SEISAKUSHO KK 发明人 HARAKAWA TAKAO
分类号 H01L21/66;(IPC1-7):01L21/66 主分类号 H01L21/66
代理机构 代理人
主权项
地址