| 摘要 |
PURPOSE:To enable high density surface mounting by arranging and coupling a plurality of vertical mount type semiconductor devices to form a semiconductor device block. CONSTITUTION:A plurality of semiconductor devices 103 are arranged and coupled to form a semiconductor device block 107. A semiconductor device block 107 consisting of a plurality of semiconductor devices 103 is of the self- standing type. Next, a semiconductor block 107 is put on the predetermined position, for example, on a printed circuit board 111 on which a solder paste is printed. Successively, the solder paste is melted by reflow with hot air and external leads 102 and the printed circuit board 111 are soldered. Since the semiconductor device block 107 is self-standing, the semiconductor block 107 is not fallen even when the adhesive solder paste is melted at the time of reflow. Accordingly, a vertical mount type semiconductor device 103 can be mounted by the high density surface mounting method. |
