发明名称 HYBRID INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To avoid the leakage of noise without deteriorating heat radiation characteristics by a method wherein a shielding case in which heat radiation holes whose diameters are small enough not to leak the noise are formed covers all the surfaces of a hybrid integrated circuit device except the surface on which outer leads are provided. CONSTITUTION:A hybrid integrated circuit device is composed of two insulated metal boards 20 and 22 and formed in a space sealed with a resin case 32. A shielding case 40 covers all the surfaces of the hybrid integrated circuit device except the surface on which outer leads 30 are provided and is composed of two metal components taking the difficulty of a press process into account. A plurality of heat radiation holes 44 whose diameters are not larger than 1/10 of the wavelength of a noise in question are formed in both the side surfaces of the shielding case 40. With this constitution, the leakage of the harmonic noise can be avoided without deteriorating heat radiation characteristics.
申请公布号 JPH05206679(A) 申请公布日期 1993.08.13
申请号 JP19910278684 申请日期 1991.09.30
申请人 SANYO ELECTRIC CO LTD 发明人 KANETANI KATAHITO;UENO SEIWA;KOBAYASHI KENICHI
分类号 H01L25/18;H01L25/04;H04N5/64;H05K9/00 主分类号 H01L25/18
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