发明名称 SOLDERABLE INSULATED WIRE
摘要 PURPOSE:To enhance heat resistivity and solderability without impairing its mechanical, electrical, chemical and other properties by using an insulating paint containing a polyamide acid or a polyimide with specified chemical structure for applying and baking it on a conductor. CONSTITUTION:An insulative paint is applied to a conductor 1 such as a copper wire to be based so as to form an insulating coat 2. Namely, an insulative paint, which is expressed by a specified general formula and contains a polyamide acid containing double bonds at both terminal ends, is applied to the conductor 1 to be baked, so that the amide group and carboxyl group in the formula turn into imido due to an intramolecular reaction and a cross-linked polyimide resin is generated due to an intramolecular reaction between respective double bonds at terminal ends while a solvent volatilizes, and finally a strong polyimide resin coat 2 is formed on the conductor 1. Accordingly, excellent thermal, mechanical, electrical, and chemical properties are provided and heat resistivity and solderability can be enhanced by applying an insulative paint containing a polyamide acid or a polyimide with specified chemical structure to the conductor 1 to be baked.
申请公布号 JPH05205538(A) 申请公布日期 1993.08.13
申请号 JP19920009791 申请日期 1992.01.23
申请人 发明人
分类号 C08F299/00;C08F290/00;C08G59/40;C09D5/25;G03F7/027;H01B3/30;H01B7/02;H01B7/29;H05K1/11;H05K3/24;H05K3/28;H05K3/34;H05K3/42;H05K3/46;(IPC1-7):H01B7/34 主分类号 C08F299/00
代理机构 代理人
主权项
地址