| 摘要 |
PURPOSE:To obtain a multilayer printed wiring board having excellent thickness accuracy by disposing and unifying a film laminate, in which a B-stage resin layer is arranged integrally to the top face of an insulating film and a low- temperature softening resin layer is arranged integrally to an underside, to a circuit pattern. CONSTITUTION:One epoxy resin-impregnated glass-cloth prepreg in thickness of 100mum is formed onto the top face of a polyimide film in thickness of 20mum and a thermosetting polyimide resin layer in thickness of 25mum onto an underside. A film laminate, in which a copper foil in thickness of 18mum is disposed and unified to an outermost layer, is arranged and unified to a circuit pattern having residual copper rate of 16% and circuit thickness of 18mum. Or the film laminate composed of the polyimide film in thickness of 50mum, a B-stage epoxy- resin coated layer in thickness of 35mum and the thermosetting epoxy resin layer in thickness of 50mum and the circuit pattern having residual copper rate of 13% and circuit thickness of 35mum are used. Accordingly, a multilayer printed wiring board having excellent thickness accuracy can be acquired. |
