| 摘要 |
PURPOSE:To prevent opening malfunction caused by water penetrating in a bonding pad by dividing the bonding pad metal into internal side and external side, by connecting internal wiring with only the bonding pad on the internal side, and by bonding the boundary section of the bonding pad as if covering it. CONSTITUTION:An interlayer film (1) 7 and an interlayer film (2) 6 are formed on a substrate 8, and a wiring polysilicon 4 is formed on the interlayer film 1. The wiring polysilicon 4 is exposed by eliminating a part of an interlayer film 6. A cover film 5 is formed by patterning a internal bonding pad 3 centering on an exposed contact point 9 and also patterning an external bonding pad 2 in the peripheral area with some space from the internal bonding pad 3. Then, a bonding wire ball 1 is bonded by compressing on the internal bonding pad and the external bonding pad. |
