| 摘要 |
PURPOSE:To ensure stabilized strength of soldering of circuit elements and enhance productivity without bridging in a surface mounting method for loading simultaneously base chip and other circuit elements on a circuit board and a metal screen used therein. CONSTITUTION:A circuit board 1 is divided into two regions E-1, E-2, base chip 10 are mounted on the surface of die pad 3 of the one region E-1 and base chip 10 are sealed by bonding a sealing region 11. Thereafter, solder cream 16 is screen-printed on the surface of respective pads 2 arranged on the other region E-2 using a metal screen 20 having an escaping part 25 in the area corresponding to the base chip 10 and the circuit elements 5 are reflow-soldered on the pad 2 for the surface mounting. |
