| 摘要 |
PURPOSE:To mount LSI chips effectively in high density and to enable high speed transmission of signal by a method wherein plural terminal resistors are arranged at the terminal block mounting positions on a ceramic substrate of the package to mount plural chips and terminal blocks. CONSTITUTION:Plural LSI chips 4 and terminal blocks 2 are mounted on the ceramic substrate 1 of a package, plural input/output pins 3 are arranged on the respective terminal blocks 2, and are connected mutually to wiring pat- terns. Plural terminal resistors 9 are arranged at the lower parts of the terminal blocks 2 on the substrate 1 being connected to electric power source wirings 10, and respective one side ends of the terminal resistors 9 are connected to signal wirings 8. The input/output pins 3 are connected to input/output pads provided on the substrate through wirings 6 on the blocks and conductors 5 on the sides of blocks. Accordingly because the terminal resistors can be mounted effectively, mounting in high density can be attained, and high speed transmission of signal can be attained by terminating with characteristic impedance. |
