发明名称 FLEXIBLE MULTILAYER CIRCUIT WIRING BOARD
摘要 PURPOSE:To provide a wiring board where a finger lead-like terminal that is hardly deformed can be provided even if a circuit conductor protruding like a finger lead is formed fine and a bend can be kept excellent in flexibility. CONSTITUTION:A circuit conductor 2, which is used for forming a finger lead- like terminal 3 of conductive material having a high Young's modulus, is provided to one end of a flexible insulating base material 1, a circuit wiring conductor 4, which is formed of conductive metal excellent in flexibility and provided with a bend A, is provided to the other end of the flexible insulating base material 1, and a conductive through-hole 5 is provided to electrically connect the circuit conductor 2 with the circuit wiring conductor 4 together.
申请公布号 JPH05206589(A) 申请公布日期 1993.08.13
申请号 JP19920034489 申请日期 1992.01.24
申请人 NIPPON MEKTRON LTD 发明人 INABA MASAKAZU;MIYAGAWA ATSUSHI;IWAYAMA TAKESHI
分类号 H01L21/60;H01L23/14;H01L23/495;H01L23/50;H01L23/538;H05K1/00;H05K1/02;H05K1/09;H05K1/11;H05K3/28;H05K3/40;H05K3/46 主分类号 H01L21/60
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